Meeting the Challenges of Advanced Node Production

Semiconductor fabs operate at the limits of physics—shrinking geometries (sub-3nm nodes), complex 3D architectures (GAA, CFET), heterogeneous integration, and high-mix/low-volume runs for advanced packaging demand inspection and handling systems that are both ultra-precise and highly adaptable. Our solutions address critical pain points:

• Detecting sub-micron defects invisible to traditional rule-based vision

• Enabling particle-free, non-contact robotic wafer handling in ISO Class 1 cleanrooms

• Providing real-time, inline metrology and process verification

• Supporting adaptive models that evolve with new process recipes and materials

• Integrating seamlessly with existing fab automation, AMHS, and MES systems

Wafer Defect Inspection & Classification — Powered by Cognex ViDi™ deep learning and MVTec HALCON hybrid AI models. Achieve >99% defect capture rate with near-zero false positives for scratches, particles, pattern anomalies, overlay errors, and contamination—deployed on high-resolution line-scan or area-scan cameras at production speeds.

Edge AI Real-Time Processing — NVIDIA Jetson Orin or Thor platforms with TensorRT-optimized inference deliver sub-10 ms latency for inline decisions. Multimodal analysis (vision + metadata) enables predictive classification and autonomous recipe adjustments without cloud dependency.

Cleanroom-Compatible Robotic Handling & Guidance — Precision 6-axis robots and collaborative cobots (cleanroom-rated) for wafer transfer, FOUP loading/unloading, and tool-to-tool transport. 3D vision-guided positioning ensures ±0.05 mm repeatability while maintaining particle generation within ISO Class thresholds.

Inline Metrology & Process Control — High-precision 3D vision for critical dimension (CD), overlay, film thickness, and bump height measurement. Data feeds directly into digital twin environments (Siemens + NVIDIA Omniverse) for real-time simulation, root-cause analysis, and predictive yield optimization.